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| A | ||
| ACC [1] | ———» | Accumulator |
| ACC [2] | ———» | Automatic Chroma Control |
| ACD | ———» | Attribute Control Display |
| ACIA | ———» | Asynchronous Communications Interface Adapter |
| ADC | ———» | Analog Digital Converter |
| ADCCP | ———» | Advanced Data Communication Control Procedure |
| ADLC | ———» | Advanced Data Link Controller |
| ADMA | ———» | Advanced Direct Memory Access |
| ADRC | ———» | Advanced Dynamic RAM Controller |
| AFLG | ———» | Attributes Flag |
| AGNUS | ———» | Address Generator Unites |
| ALE | ———» | Address Latch Enable |
| ALU | ———» | Arithmetic and Logic Unit |
| - AMD - | ———» | Advanced Micro Devices |
| - AMI - | ———» | American Megatrends Incoperation |
| AOQ | ———» | Average Outgoing Quality |
| APS | ———» | Active Pixel Sensor |
| APU | ———» | Arithmetic Processor Unit |
| AS | ———» | Address Strobe |
| ASIC | ———» | Application Specific Integrated Ciruit |
| ATE | ———» | Automated Test Equipment |
| AVDC | ———» | Advanced Video Display Controller |
| AWDL | ———» | Advanced Weapon Data Link |
| ———» | ||
| B | ||
| BA | ———» | Bus Available |
| BADS | ———» | Bus Address Status |
| BBR | ———» | Branch on Bit Reset |
| BBS | ———» | Branch on Bit Set |
| BBUL | ———» | Bumpless Build-Up Layer |
| BCC | ———» | Block Check Character |
| BCP | ———» | Byte-Control Protocol |
| BCR | ———» | Byte Count Register |
| BEP | ———» | Burst Error Processor |
| BGA | ———» | Ball Grid Array |
| BHE | ———» | Bus High Enable |
| BIU | ———» | Bus Interface Unit |
| BJT | ———» | Bipolar Junction Transistors |
| BNA | ———» | Bus Next Address Request |
| BOP | ———» | Bit-Oriented Protocol |
| BPR | ———» | Block Protect RAM |
| BQFP | ———» | Bumpered Quad Flat Package |
| BRG | ———» | Baud Rate Generator |
| BSC | ———» | Binary Synchronous Communication |
| BU | ———» | Bus Unit |
| ———» | ||
| C | ||
| CALEN | ———» | Cache Address Latch Enable |
| CBGA | ———» | Ceramic Ball Grid Array |
| CCC | ———» | Ceramic (leadless) Chip Carrier |
| CCD | ———» | Charge-Coupled Device |
| CCGA | ———» | Ceramic Column Grid Array |
| CCLK | ———» | Character Clock |
| CCR | ———» | Channel Command Register |
| CDIP | ———» | Ceramic Dual Inline Package |
| CDR | ———» | Compare Data Register |
| CERDIP | ———» | Ceramic Dual Inline Package |
| CERPACK | ———» | Ceramic Flat-Pack |
| CERQUAD | ———» | Ceramic Quad Inline Package |
| CFR | ———» | Control and Format Register |
| CHMOS | ———» | Complementary High-density Metal Oxide Semiconductor |
| CIA | ———» | Complex Interface Adapter |
| CISC | ———» | Complex Instruction Set Computing |
| CLCC | ———» | Ceramic Leadless Chip Carrier |
| CLK | ———» | Clock |
| CMAC | ———» | Color / Monochrome Attribute Controller |
| - CMD - | ———» | California Micro Devices |
| CMOS | ———» | Complementary Metal Oxide Semiconductor |
| CMPAK | ———» | Compact Mini Package |
| COP | ———» | Character-Oriented Protocol |
| COSMAC | ———» | Complementary Silicon Metaloxide Conductor |
| CPGA | ———» | Ceramic Pin Grid Array |
| CPI | ———» | CMOS Parallel Interface |
| CPLD | ———» | Complex Programmable Logic Device |
| CPR | ———» | Command Pointer Registor |
| CPU | ———» | Central Process Unit |
| CQFP | ———» | Ceramic Quad Flat-Pack |
| CQJB | ———» | Ceramic Quad FJ-Bend |
| CREEM | ———» | Combination ROM / EEPROM Memory Unit |
| CRT | ———» | Cathode Ray Tube |
| CRTC | ———» | Cathode Ray Tube Controller |
| CSOP | ———» | Ceramic Small Outline Package |
| CSP | ———» | Chip Scale Package |
| CSR | ———» | Composite Status Register |
| CTC | ———» | Couter / Timer Circuit |
| CTO | ———» | Construction Time Overflow |
| CVDG | ———» | Color Video Display Generator |
| ———» | ||
| D | ||
| DAC | ———» | Digital Analog Converter |
| DACIA | ———» | Dual Asynchronous Communications Interface Adapter |
| DAR | ———» | Data Assembly Register |
| DART | ———» | Dual Asynchronous Receiver / Transmitter |
| DCD | ———» | Data Carrier Detect |
| DCE | ———» | Data Circuit Terminating Equipment |
| DCGG | ———» | Display Character and Graphics Generator |
| DCP | ———» | Data Ciphering Processor |
| DDFDC | ———» | Double-Density Floppy Disk Controller |
| DDR - SDRAM | ———» | Double Data Rate Synchronous Dynamic Random Access Memory |
| - DEC - | ———» | Digital Equipment Corporation |
| DES | ———» | Data Encryption Standard |
| DFP | ———» | Dual Flat Package |
| DIMM | ———» | Dual Inline Memory Module |
| DIO | ———» | Data Input / Output |
| DIP | ———» | Dual Inline Package |
| DIR | ———» | Data Input Register |
| DMA | ———» | Direct Memory Access |
| DMC | ———» | Dynamic Memory Controller |
| DMAC | ———» | Direct Memory Access Controller |
| DPAK | ———» | Deca-Watt Package |
| DPM | ———» | Dual-Port RAM Memory Unit |
| DPR | ———» | Destination Pointer Register |
| DRAM | ———» | Dynamisches Random Access Memory |
| DSD | ———» | Data Security Device |
| DSO | ———» | Dual Small Outline Package |
| DSP | ———» | Digital Signal/Array Processing |
| DSR | ———» | Data Set Ready |
| DTC | ———» | DMA Transfer Controller |
| DTE | ———» | Data Terminating Equipment |
| DTL | ———» | Diode Transistor Logic |
| DTR | ———» | Data Terminal Ready |
| ———» | ||
| E | ||
| EBGA | ———» | Enhanced Ball Grid Array |
| ECL | ———» | Ermitter Coupled Logic |
| ECR | ———» | Error Control Register |
| EDC | ———» | Error Detection and Correction Unit |
| EDCU | ———» | Error Detection and Correction Unit |
| EDO-DRAM | ———» | Extended Data Output Random Access Memory |
| EPA | ———» | Environmental Protection Agency |
| EPIC | ———» | Explicitly Parallel Instruction Computing |
| EPLD | ———» | Erasable Programmable Logic Device |
| EPROM | ———» | Eraseable Programmable Read Only Memory |
| ERP | ———» | Extremely small Resin Package |
| EU | ———» | Execution Unit |
| ———» | ||
| F | ||
| FBGA | ———» | Flip Ball Grid Array |
| FC | ———» | Flip Chip |
| FC - BGA | ———» | Flip Chip Ball Grid Array |
| FC - LGA | ———» | Flip Chip Land Grid Array |
| FC - PGA | ———» | Flip Chip Pin Grid Array |
| FDD | ———» | Floppy Disk Drive |
| FFT | ———» | Fast Fourier Transform |
| FIFO | ———» | First-In First-Out Register |
| FIO | ———» | FIFO Input / Output Interface Unit |
| FIR | ———» | Finite Impulse Response |
| FIRQ | ———» | Fast-Interrupt Request |
| FLC | ———» | Switching Frame Level Controller |
| FPAA | ———» | Field Programmable Analog Array |
| FPAK | ———» | Flat Package |
| FPBGA | ———» | Fine Pitch Ball Grid Array |
| FPC | ———» | Fuse Programmable Controller |
| FPGA | ———» | Field-Programmable Gate Array |
| FPP | ———» | Floating Point Processor |
| FPQFP | ———» | Fine Pitch Quad Flat Package |
| FPT | ———» | Fine Pitch Technology |
| FPU | ———» | Floating Point Unit |
| FQFP | ———» | Fine Pitch Quad Flat Package |
| FRAM | ———» | Ferroelectric Random Access Memory |
| ———» | ||
| G | ||
| GAL | ———» | Generic Array Logic |
| GCR | ———» | General Command Register |
| GDR | ———» | General Delay Register |
| GDT | ———» | Global Descriptor Table |
| GGI | ———» | Global Geospatial Intelligence |
| GPIA | ———» | General-Purpose Interface Adapter |
| GPIB | ———» | General-Purpose Interface Bus |
| GMR | ———» | General Mode Register |
| - GTE - | ———» | General Telephone and Electronics |
| ———» | ||
| H | ||
| H-PBGA | ———» | High-thermal Plastic Ball Grid Array |
| HCTE | ———» | High Coefficient of Thermal Expansion |
| HDLC | ———» | High-Level Data Link Control |
| HDRC | ———» | High Dynamic Range CMOS |
| HiTCE | ———» | High Thermal Coefficient of Expansion |
| HMOS | ———» | High-Performance Metal-Oxide Semiconductor |
| ———» | ||
| I | ||
| I²L | ———» | Integrated Injection Logic |
| I³L | ———» | Isoplanar Integrated Injection Logic |
| IB | ———» | Information Bus |
| - IBM - | ———» | International Business Machines Corporation |
| IC | ———» | Integrated Cicuits |
| ICB | ———» | Interrupt Control Bit |
| ICU | ———» | Interrupt Control Unit |
| ICWS | ———» | Initialization Command Words |
| - IDT - | ———» | Integrated Device Technology, |
| IER | ———» | Interrupt Enable Register |
| IFR | ———» | Interrupt Flag Register |
| IIA | ———» | Industrial Interface Adapter |
| IIR | ———» | Infinite Inpulse Response |
| - IIT - | ———» | Illinois Institute of Technology |
| IMR | ———» | Interrupt Mask Register |
| INTR | ———» | Interrupt Request Input |
| IOC | ———» | I/O Bus Controller |
| IOPL | ———» | I/O Privilege Level |
| IPC | ———» | Intelligent Peripheral Controller |
| IR | ———» | Instruction Register |
| IRD | ———» | Receiver Interrupt Request Disabled |
| IRQ | ———» | Interrupt Request |
| ISA [1] | ———» | Instruction Systolic Array |
| ISA [2] | ———» | Instruction Set Architecture |
| ISAR | ———» | Indirect Scratchpad Address Register |
| ISP | ———» | In-System Programming |
| ITA | ———» | Independent Transistor Array |
| ITRS | ———» | International Technology Roadmap for Semiconductors |
| IVR | ———» | IRQ Vector Register |
| ———» | ||
| J | ||
| ———» | ||
| K | ||
| ———» | ||
| L | ||
| LANC | ———» | Local Area Network Controller |
| LBA | ———» | Local Bus Access |
| LCBGA | ———» | Low Cost Ball Grid Array |
| LCC | ———» | Leadless Chip Carrier |
| LCCC | ———» | Leadless Ceramic Chip Carrier |
| LCE | ———» | Low Cost Emulator |
| LDPAK | ———» | Large Deca-Watt Package |
| LDT | ———» | Local Descriptor Table |
| LFCSP | ———» | Lead Frame Chip Scale Package |
| LGA | ———» | Land Grid Array |
| LIFO | ———» | Last-In First-Out |
| LLD | ———» | Leadless Diode |
| LLP | ———» | Leadless Leadframe Package |
| LPR | ———» | List Pionter Register |
| LQFP | ———» | Low Quad Flat-Package |
| LRP | ———» | Large Resin Package |
| LSB | ———» | Least Significant Bits |
| - LSCC - | ———» | Lattice Semiconductor Corporation |
| LSI | ———» | Large Scale Integration |
| LVR | ———» | Last Vector Register |
| ———» | ||
| M | ||
| MADL | ———» | Multifunction Advanced Data Link |
| MAR | ———» | Memory Address Register |
| MCE | ———» | Master Cascade Enable |
| MCM | ———» | Multi Chip Module |
| MCU | ———» | Microcomputer Unit |
| MDIP | ———» | Molded (Plastic) Dual Inline Package |
| MELF | ———» | Metal Electrode Face |
| MEMS | ———» | Microelectromechanical System |
| Micro - PGA | ———» | Micro Pin Grid Array |
| MIVR | ———» | Multiplexor Interrupt Vector Register |
| MMPU | ———» | Memory Management and Protection Unit |
| MMU | ———» | Memory Management Unit |
| MMW | ———» | Millimeter Wave |
| MOP | ———» | Mini Octlead Package |
| MOSFET | ———» | Metal Oxide Semiconductor Field Effect Transistor |
| MPAK | ———» | Mini Package |
| MPCC | ———» | Multiple Protocol Communications Controller |
| MPI | ———» | Message Passing Interface |
| MPP | ———» | Massively Parallel Processing |
| MPSC | ———» | Multi-Protocol Serial Controller |
| MPU | ———» | Microprocessor Unit |
| MQFP | ———» | Metric Quad Flat Package |
| MQUAD | ———» | Metric Quad Flat Package |
| MRAM | ———» | Magneto-resistive Random Access Memory |
| MSB | ———» | Most Significant Bits |
| MSB | ———» | Most Significant Bits |
| MSI | ———» | Medium Scale Integration |
| MSOP | ———» | Mini Small Outline Package |
| MST | ———» | Micro System Technology |
| MTC | ———» | Memory Timing Controller |
| MTPR | ———» | Multiplexor Table Pointer |
| ———» | ||
| N | ||
| NCA | ———» | Non-Cacheable Access |
| NEMS | ———» | Nanoelectromechanical System |
| NMI | ———» | Non-Maskable Interrupt Request |
| NMOS | ———» | N-Channel Metal-Oxide Semiconductor |
| NPX | ———» | Numeric Processor Extension |
| ———» | ||
| O | ||
| OCWs | ———» | Operation Command Words |
| OBGA | ———» | Organic Ball Grid Array |
| OCSS | ———» | Ocean Communications and Sensor System |
| OLGA | ———» | Organic Land Grid Array |
| OPGA | ———» | Organic Pin Grid Array |
| OSSS | ———» | Operational Space Services and Support |
| OTA | ———» | Operational Transconductance Amplifier |
| OTP | ———» | One-Time Programmable ROM |
| OVCC | ———» | Open Via Chip Carrier |
| ———» | ||
| P | ||
| PAL | ———» | Programmable Array Logic |
| PBGA | ———» | Plastic Ball Grid Array |
| PCLK | ———» | Peripheral Clock |
| PCM | ———» | Phase Change Memory |
| PCR | ———» | Peripheral Control Register |
| PCRAM | ———» | Phase Change Random Access Memory |
| PDIP | ———» | Program Development Unit |
| PDP | ———» | Programmed Data Processor |
| PDU | ———» | Plastic Dual Inline Package |
| PEG | ———» | Programmable Event Generator |
| PGA | ———» | Pin Grid Array |
| PIA | ———» | Peripheral Interface Adapter |
| PIAT | ———» | Peripheral Interface Adapter Timer |
| PIC | ———» | Programmable Interrupt Controller |
| PIO | ———» | Parallel Input / Output |
| PKCC | ———» | Programmable Keyboard and Communications Controller |
| PLCC | ———» | Plastic Leaded Chip Carrier |
| PLD | ———» | Programmable Logic Device |
| PLGA | ———» | Plastic Land Grid Array |
| PLL | ———» | Phase Locked Loop |
| PMC | ———» | Parity Mode Control |
| PME | ———» | Parity Mode Enabled |
| PMI | ———» | Programmable Multiport Interface |
| PMOS | ———» | P-Channel Metal-Oxide Semiconductor |
| PPGA | ———» | Plastic Pin Grid Array |
| PPI | ———» | Programmable Peripheral Interface |
| PQ2 | ———» | Power Quad Flat Package Type 2 |
| PQFP | ———» | Plastic Quad Flat Package |
| PRAM | ———» | Phase-change Random Access Memory |
| PROM | ———» | Programmable Read Only Memory |
| PSO | ———» | Plastic Small Outline Package |
| PSU | ———» | Program Storage Unit |
| PTM | ———» | Programmable Timer Module |
| PUT | ———» | Programmable Unijunction Transistor |
| PVTC | ———» | Programmable Video Timer Controller |
| ———» | ||
| Q | ||
| QFI | ———» | Quad Flat I-Leaded Package |
| QFJ | ———» | Quad Flat J-Leaded Package |
| QFN | ———» | Quad Flat Non-Leaded Package |
| QFP | ———» | Quad Flat Package |
| QIP | ———» | Quad Inline Package |
| QSOP | ———» | Quarter Size Outline Package |
| QTCP | ———» | Quad Tape Carrier Package |
| QUAD | ———» | Quad Inline Package |
| QUIP | ———» | Quad Inline Package |
| ———» | ||
| R | ||
| RAM | ———» | Random Access Memory |
| - RCA - | ———» | Radio Corporation of America |
| RDRAM | ———» | Rambus Dynamic Random Access Memory |
| RDSR | ———» | Receiver Data Service Request |
| REM | ———» | Receiver Echo Mode |
| RIOT | ———» | RAM-I/O Timer |
| RISC | ———» | Reduced Instruction Set Computing |
| RMB | ———» | Reset Memory Bit |
| ROM | ———» | Read Only Memory |
| RQM | ———» | Request for Master |
| RRIOC | ———» | ROM-RAM-I/O Counter |
| RRIOT | ———» | ROM-RAM-I/O Timer |
| RTC | ———» | Real-Time Clock plus RAM |
| RTL | ———» | Resistor Transistor Logic |
| RxC | ———» | Receiver Clock |
| RxD | ———» | Received Data |
| ———» | ||
| S | ||
| SBGA | ———» | Super Ball Grid Array |
| SCC | ———» | Serial Communications Controller |
| SCI | ———» | Serial Communications Interface |
| SCR [1] | ———» | Sub-Channel Register |
| SCR [2] | ———» | Silicon Controlled Rectifier |
| SD | ———» | Side-brazed Ceramic Dual Inline Package |
| SDIP | ———» | Shrink Dual Inline Package |
| SDLC | ———» | Synchronous Data Link Control |
| SDRAM | ———» | Synchronous Dynamic Random Access Memory |
| SECC | ———» | Single Edge Cartridge Connector |
| SGA | ———» | Solder Grid Array |
| SID | ———» | Sound Interface Device |
| SIMD | ———» | Single Instruction Miltiple Data |
| SIMM | ———» | Single Inline Memory Module |
| SIO | ———» | Serial Input / Output |
| SIP | ———» | Single Inline Package |
| SISR | ———» | Serial Interface Status Register |
| SMB | ———» | Set Memory Bit |
| SMC | ———» | Surface Mount Ceramic Capacitor |
| SME | ———» | Surface Mount Electrolytic Capacitor |
| SMR | ———» | Surface Mount Resistor |
| SMT | ———» | Surface Mount Transistor |
| SMTA | ———» | Surface Mount Tantalum Capacitor |
| SMPAK | ———» | Super Mini Package |
| SO | ———» | Small Outline |
| SOC | ———» | System on Chip |
| SOD | ———» | Small Outline Diode |
| SOI | ——— | |