783-Pin Flip Chip Ball Grid Array <FCBGA>
483-Pin High Coefficient of Thermal Expansion -BGA- <HCTE>
360-Pin High Thermal Coefficient of Expansion -LGA- <HiTCE-LGA>
10-Pin Lead Frame Chip Scale Package <LFCSP>
28-Pin Lead Frame Chip Scale Package <LFCSP>
64-Pin Lead Frame Chip Scale Package <LFCSP>
10-Pin Mini Small Outline Package <MSOP>
20-Pin Quarter Size Outline Package <QSOP>
64-Pin Quad Inline Package <QUIP>