Chip Package List Mainpage
Chip Package List Mainpage
Chip Package List Mainpage
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CBGA CERDIP CERPACK CERQUAD CPGA CQFP CQJB CSOP CSP EBGA EQUAD FBGA FC-PGA FLATPACK LCC LLP LQFP MDIP PBGA PLCC PPGA PQFP SBGA SIDEBRAZE DIP TQFP another





CERDIP-Package

CBGA
<Ceramic Ball Grid Array>
CERDIP-Package

CERDIP
  • Package Technology:
     
    Pressed Alumina Ceramic

  • DIE Attach Material:
     
    Silver-Filled Glass

  • Type:
     
    Inorganic Adhesive
<Ceramic Dual Inline Package>


CERPACK-Package

CERPACK
<Ceramic Flat-Pack>


CERQUAD-Package

CERQUAD
<Ceramic Quad Inline Package>


CPGA-Package

CPGA
  • Package Technology:
     
    Laminated Alumina Ceramic

  • DIE Attach Material:
     
    Gold-Silicon Eutectic 
    Silver-Filled Cyanate Ester

  • Type:
     
    Hard Solder 
    Organic Addhesive
<Ceramic Pin Grid Array>


CQFP-Package

CQFP
  • Package Technology:
     
    Laminated Alumina Ceramic

  • DIE Attach Material:
     
    Gold-Silicon Eutectic 
    Silver-Filled Cyanate Ester

  • Type:
     
    Hard Solder 
    Organic Addhesive
<Ceramic Quad Flat-Pack>




CQJB-Package

CQJB
<Ceramic Quad J-Bend>




CSOP-Package

CSOP
<Ceramic Small Outline Package>


CSP-Package

CSP
<Chip Scale Package>


EBGA-Package

EBGA
<Enhanced Ball Grid Array>


EQUAD-Package

EQUAD
< >


FBGA-Package

FBGA
<Flip Ball Grid Array>


FC-PGA-Package

FC-PGA
<Flip-Chip Pin Grid Array>

FLATPACK-Package

FLATPACK
<Metal Flat-Package >


LCC-Package

LCC
<Leadless Chip Carrier>


LLP-Package

LLP
<Leadless Leadframe Package>


LQFP-Package

LQFP
<Low Quad Flat-Package>
MDIP-Package

MDIP
  • Package Technology:
     
    Molded Plastic

  • DIE Attach Material:
     
    Silver-Filled Epoxy

  • Type:
     
    Organic Addhesive
<Molded (Plastic) Dual Inline Package>


PBGA-Package

PBGA
<Plastic Ball Grid Array>

PLCC-Package

PLCC
<Plastic Leaded Chip Carrier>




PPGA-Package

PPGA
<Plastic Pin Grid Array>


PQFP-Package

PQFP
<Plastic Quad Flat-Package>


SBGA-Package

SBGA
<Super Ball Grid Array>


SIDEBRAZE DIP-Package

SIDEBRAZE DIP
  • Package Technology:
     
    Laminated Alumina Ceramic

  • DIE Attach Material:
     
    Gold-Silicon Eutectic 
    Silver-Filled Cyanate Ester

  • Type:
     
    Hard Solder 
    Organic Addhesive
<Sidebraze Dual Inline Package>


TQFP-Package

TQFP
<Thin Quad Flat Package>
  • Wafer: Silicon Wafer Processing / Technology
  • FCiP: Flip Chip in Package Technology
     
  • HiTCE: High Thermal Coefficient of Expansion Technology
     
  • PLGA: Plastic Land Grid Array
  • PSOJ: Plastic Small Outline J-Bend
     
  • PSOP: Plastic Small Outline Package
  • PZIP: Plastic Zig Zag Inline Package
     
  • SECC: Single Edge Contact Cartridge
     
  • SEPP: Single Edge Processor Package
     
  • PZIP: Plastic Zig Zag Inline Package
     
  • TBGA: Tape Ball Grid Array
     
  • TCP: Tape Carrier Package